20 Advantages of Vapor Phase Reflow Soldering

  • No need for setting up temperature profiles since condensing vapor transfers the heat.
  • It's impossible to heat up the components higher than the temperature of the condensing vapor (e.g. 200°C or lead-free soldering of SnAg3, 5 with 230°C). Therefore no overheating can occur.
  • Trouble free single circuit board assembly manufacturing
  • Processing conditions are absolutely reproducible, even in long-term
  • Uniform temperature distribution across the entire PCB.
  • Delaminating of circuit boards will not occur.
  • The vapor provides a 100% inert gas atmosphere.
  • All components can be reliably soldered (including all kinds of BGA).
  • Due to the low maximum temperature of 200°C the danger of popcorn cracking is minimized.
  • Optional preheat on top or below the PCB.
  • Repair is easy. Desoldering is accomplished without damaging the PCB or components (even QFP320 or all kinds of BGAs or CGAs).
  • Low operating costs due to minimized liquid agent drag out.
  • Integrated cooling system based on air convection.
  • Optional rapid cooling system for minimizing the growth of intermetallic phases. Even heavy boards can be cooled up to 5 K/sec for a fast temperature drop below the solidification temperature of the solder.
  • Environmental compatible soldering process because there are less aggressive flux vapors than in other reflow procedures.
  • Window for observation of the soldering process.
  • Only vapor phase soldering fulfils 100% of ISO 9000 requirements.
  • After 15-20 minutes the machines are ready for soldering.
  • Currently the most cost effective reflow soldering process.
  • Optional: Void free vacuum soldering in vapor phase. (Patented)



The CSI Company, LLC
10 Derry St.
Nashua, NH 03063
Office Number: 603-594-9909
Fax Number: 603-594-9913